Product

Inspur OCP Compute Node: Energy Efficiency

Key Features:

High Density & Excellent Performance

  • 4 types of mixable high-density nodes optimized for difference application scenarios

Energy Conservation

  • Centralized power

All nodes & I/O front access fit hyper-scale data centers  

Converged Architecture

  • One motherboard converts 4 types of compute node for multiple applications
  • High quality, easy maintenance and high cost efficiency

Downloadable Resources:
Data Sheets

Overview:

Inspur OCP Compute Family

High-Density Converged Architecture

Inspur’s OCP portfolio has added 4 new configurations of compute node based on the “San Jose” Motherboard, the first OCP-accepted motherboard based on the Intel® Xeon® Scalable processor.

Specifications:

 

Model Inspur OCP Compute Node: Energy Efficiency
CPU 2 x Intel® Xeon® Scalable Processer, TDP up to 165W
Chipset Intel® C622
Memory 16 x DDR4 DIMM; Support RDIMM/LRDMM/NVDIMM
Storage Front:2 x2.5 HDD; Internal:  2 x M.2 SATA/PCIe x4
Ethernet No integrated Ethernet port; OCP2.0 Ethernet card optional
I/O 2 PCIe x16 slot (FHFL)
PSU Bus Bar
Dimension 830mm (L) × 537mm (W) × 95.2mm (H)
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