OCP Summit 2020 Inspur Virtual Showcase

Welcome to Inspur's OCP Summit 2020 virtual showcase. See total open compute solutions for next-generation applications and dynamic open innovations in AI, cloud optimization, storage, and networking.

Total Open Solutions for Tomorrow's Data Center.

Inspur is back this year with new innovations in compute, AI, storage, and networking to supercharge the open data center. Releases include the Cloud Optimized Rack Solution for SAP HANA with Optane persistent memory; Open Accelerator Infrastructure (OAI) and UBB-compliant rack scale AI platform; an open storage platform collaboration with Samsung; and network switches supporting the SONiC open source network OS.

Experience the official interactive booth at the OCP Virtual Summit site.

Visit the virtual booth »

See Inspur’s complete OCP product portfolio.

Go to Open Solutions Page »

TECHNOLOGY HIGHLIGHTS

AI

Acceleration of AI on open hardware via Open Accelerator Infrastructure (OAI) and UBB-compliant rack scale architecture

Compute

Pushing compute performance and flexibility for various applications on a high-density 2U 4-socket cloud-optimized server

Storage & Networking

Disaggregated open storage with NVMeoF interface, and interconnect platforms supporting SONiC open network

Product Showcase

AI

 

Accelerating AI Hardware Integration with OCP UBB and OAI

The OAI (Open Accelerator Infrastructure) specification unifies the technical specifications of the accelerator module and simplifies the design complexity of the AI accelerator system, thereby shortening time to market for the hardware system.

Inspur MX1 21” OAI UBB System

Inspur MX1 21” OAI UBB System

21-inch rack-scale OAM solution providing scale up with simplified inter-module communication, scale out with input/output bandwidth.

Disparate network architectures supported through OAM direct connect, delivering increased efficiency, flexibility and manageability.

Features two OCP interconnect topologies: Hybrid Cube Mesh (HCM), Fully Connected (FC).

More Details

Take a look inside the MX1

A hands-on look inside the MX1 OAI UBB system: its unique tray design, UBB integration, and connecting it to an ON5263M5 OCP compute node.

OCP Rack Solution for AI

Use Case 1: OAI UBB Rack with x8 OAM

  • built-in AI acceleration from integrated Intel Deep Learning Boost
  • supports large cluster training

Use Case 2: Open Rack with x8 JBOG + x4 Compute Nodes

  • flexible GPU pooling
  • supports AI accelerators for various AI applications

More Details

High-Density Compute

 

Versatile Cloud-Optimized 4-Socket Platform Pushes Boundaries in Density and Compute

The first high-density cloud-optimized four-socket platform for the CSP market jointly announced by Inspur and Intel at last year’s OCP Global Summit, the Inspur NF8260M5 delivers energy efficiency to enable the highest number of single rack cores while lowering TCO. This cloud optimized solution has been adopted by customers in hyperscale, Fintech Cloud, enterprise and other segments requiring high computing workloads.

SAP HANA Solution with Intel® Optane™

Based on the high-density 2U 4-socket Inspur NF8260M5 server, this solution is validated for the second-generation Intel Xeon Scalable processor, optimized with Intel Optane persistent memory, and certified for SAP HANA®.

The Inspur OCP Cloud Optimized Rack Solution for SAP HANA is a fully integrated rack solution combining OCP recognized hardware and validated software to provide database capacity that can be doubled for a lower price. Customers who have multiple SAP HANA older gen nodes, where memory capacity is the limiting factor, can upgrade multiple analytics nodes (scale out) into one consolidated analytics node (scale up) with more In Memory database capacity.

OCP Rack Solution for SAP HANA with Intel Optane

See OCP Rack Solution for SAP HANA

NF8260M5 Cloud-Opimized High-Density 4-Socket Platform

  • Joint OCP Accepted™ contribution by Inspur and Intel
  • Scalable 4P performance for enterprise in a dense 2U form factor
  • Up to two 2000W power supplies to support multi-workloads
  • Flexibly expandable with eight PCI-E slots
  • Intel Optane Memory
  • SAP HANA Certified

NF8260M5 Product Page »

Redis Workload Demo on the OCP Accepted 2U 4-Socket NF8260M5

In this video, see Inspur’s cloud-optimized 4-socket NF8260M5 leverage Intel Optane Memory to deliver ideal performance for enterprise cloud workloads.

Inspur Servers Leveraging Seagate HD and Storage Technology

Inspur is currently evaluating and qualifying new products from our partner Seagate for next-generation platforms and solutions: the MACH.2 hard drive and HAMR (heat assisted magnetic recording) storage technology.

The MACH.2 multi-actuator hard drive enables hyperscale data centers to tap into massive performance gains without sacrificing latency, while HAMR technology delivers extreme capacity and performance in storage.

Learn more about MACH.2 and HAMR »

Seagate MACH.2 Multi-Actuator Hard Drive Seagate Exos Drive with HAMR Technology

Open Storage

 

Open Storage Platform Collaboration with Samsung

Disaggregated and shared storage solution with a HW infrastructure that will be contributed to the OCP community.

Disaggregated and Shared NVMeoF Interface New Industry Standard SSD Form Factor
  • The latest PCIe Gen4 based dual-socket system
  • Supports up to 32x NVMe SSDs in 1U
  • Utilizes EDSFF 1U Short (E1.S) Form Factor

Open Storage Solution Page »

Networking

 

Smart Connect (SC) Series Data Center Switches with SONiC Support

SC8661SL
Aggregation Switch

SC8661SL Open Network Switch

  • Supports up to 32 x 100GE and 8 x 400GE interface cards, 128 100GE or 32 400GE ports
  • Interface card supports hot-swap and redundant design of key components
  • Single-chip centralized forwarding reduces network forwarding delay compared to multi-chip distributed systems
  • Suitable for Spine-leaf data center networks
SC5630EL
Access Switch

SC5630EL Open Network Switch

  • 48-port 1GE / 10GE / 25GE multiple rate access
  • Redundant design of key components to improve equipment availability
  • Suitable for data center TOR switches

Take a look at the hardware and design of Inspur’s two open data center networking solutions supporting the SONiC open source network OS.

Security

High-Density Compute to Support the Trusted Supply Chain 

Rack-Level Management

In order to meet the demands of customers for data center management, maintenance optimization and system design, the OpenRMC project was launched to help small and medium-sized data center customers greatly reduce their IT operation and maintenance costs, simplify software-based rack management and improve efficiency.

Inspur provides an OpenRMC compliant rack level hardware management infrastructure and rack level software management stack that includes web server service and client tools.

Learn more about the project »

OpenRMC OCP Rack Management Solution

KEYNOTES, SESSIONS AND WORKSHOPS

May 12

Summit Keynote

Adopt Compute, AI, Storage and Total Solutions

Alan Chang, Inspur Deputy GM & Sr. Director of Server Product Line

Download Presentation Deck »

Watch Presentation on OCP Summit Official Site »


Summit Keynote

A New Multi-Industry Collaboration for an Open Storage Platform

Jongyoul Lee, Samsung Software Development Team Leader
featuring Alan Chang, Inspur Deputy GM & Sr. Director of Server Product Line

Watch Presentation on OCP Summit Official Site »

Expo Hall Session

Innovation in Open Storage Solutions

Alan Chang, Inspur Deputy GM & Sr. Director of Server Product Line

Download Presentation Deck »

Watch Presentation on OCP Summit Official Site »


Engineering Workshop

OAM Reference Systems Joint Review

YJ Huang, Inspur Development Manager, and others

Download Presentation Deck »

Watch Presentation on OCP Summit Official Site »


May 13

Engineering Workshop

OCP OpenRMC Joint Overview and Update

Han Wang, Inspur Senior Architect, with John Leung, Intel Principal Engineer

Download Presentation Deck »

Watch Presentation on OCP Summit Official Site »


Executive Track Session

From OCP Hardware to OCP Total Solution

Yinan Liu, Inspur Customer Program Manager

Download Presentation Deck »

Watch Presentation on OCP Summit Official Site »

TECHNOLOGY PARTNERSHIPS

Intel Logo Samsung Logo Seagate Logo SONiC Logo