Past Event

OCP Global Summit 2022

Join Us to Empower Open.

The OCP Global Summit is the largest gathering of technologists looking to apply the benefits of open source and open collaboration to hardware and software, and rapidly increase the pace of innovation in, near and around the data center and beyond. This year’s Summit will be three jam-packed days, and brings together the brightest engineers and business leaders who will share the technologies present in best-in-class solutions. You will hear about challenges to match the fast-paced demand for advanced compute, storage, and network performance.

See Inspur’s Digital OCP Summit Showcase »

Visit Inspur at Booth #A23!

Technology Highlights:
  • Technology Collaborations
    Partnerships with Samsung, Ampere and Habana to bring deeper solution offerings by integrating various technologies on innovative open designs.
  • Inspur DC-SCM (Data Center Ready Secure Control Module) Design
    Follows OCP DC-SCM 1.0 specification, decoupling controllers and hardware resources to enable modular server management on a common form factor.
  • OCP Inspired™ Platforms
    Platforms leveraging open architecture, high performance, high memory density and efficiency to support data-intensive cloud and enterprise workloads.

Inspur Sessions:

Sustainability Innovations in Inspur Servers

Oct 18, Tuesday | 3:30pm – 3:55pm
@ Room 210CG

 Addressing the data center industry’s carbon neutrality goals, in this session Inspur will introduce its sustainability initiatives including end-to-end liquid cooling products and collaborations to advance energy efficiency standards.

Accelerate Adoption: Inspur Open GP-Enterprise Solutions

Oct 19, Wednesday | 12:40pm – 12:55pm
@ Expo Hall

 Leveraging the OCP specifications to deliver products that cover 3x most popular silicon, Inspur gradually integrates this trend with the DC-HMS concept to apply the “OCP Adoptive” to the traditional 1U/2U form factors.

Ampere Mt. Mitchell Server Motherboard Specification

Oct 19, Wednesday | 4:25pm – 4:50pm
@ Room 220C

 Ampere and Inspur will jointly present the overview of the Mt. Mitchell motherboard design specification submitted to OCP, demonstrating the flexibility and consideration of current and future processor support for a common design to meet CSP needs in 1U and 2U chassis.

OCP Hardware Management Modules – presented by Gowin and Inspur

Oct 20, Thursday | 10:45am – 10:55am
@ Expo Hall

 Inspur and Gowin will discuss scalability, flexibility, sustainability of OCP Hardware Management Modules by implementing DC-SCM 2.0 LTPI- RoT and TPM functions in modern FPGAs, and integrating DC-SCM to support PFR and TPM on management board.