High density
Ultra Dense Enclosure and Compute Node
The Inspur i24 high-density platform integrates high performance and workload capability in a compact 2U chassis. Its high compute density and flexible configuration makes it the ideal platform for Hyperscale Infrastructure, Cloud Computing and HPC.
Key Features
Specifications
Model | i24 Node |
---|---|
Form Factor | 2U |
Chipset | Intel® C622/624 series chipset |
Processor | 2 Intel Xeon Scalable processors |
Processor Core Available | Maximum 28-core per processor |
Processor Speed | 3.6 GHz, maximum depending on processor |
Memory Slot | 16 DIMM slots, Capacity up to 1TB (64G x 16) |
Memory Type | RDIMMs, LDIMMs and NVDIMM |
Memory Protection Features | ECC |
Storage Controller |
|
I/O Expansion Slot | Up to 3 PCIE slot |
Network Controller | Support OCP/PHY, external PCI-E card |
MIC | 1x independent 1000Mbps NIC for remote control |
DVD ROM | Aspeed2500 COD, 64MB video memory, resolution up to 1280*1024 |
Integrated I/O Port | SUV interface board (2x RS-232 + 1x VGA +2x USB 2.0) |
Internal Storage | 2xSATA M.2 SSDs |
Storage |
|
Power Supply |
|
Fan | 4x80mm system fans in the middle of the enclosure |
Dimensions |
2.5” enclosure: 446(W)*87.5(H)*805(D)mm 3.5” enclosure: 446(W)*87.5(H)*845(D)mm |
Management | Integrate BMC+CMC and IKVM remote management module compliance to IPMI2.0, supporting KVM over IP, and Redfish |
Supported Operating Systems | Linux and Windows |
Operating Temperature | 5℃~35℃ |
Input Voltage | 110-240V |
Warranty | 3 years standard warranty |