High-Density 2U 4-Socket Server for the Enterprise Cloud

OCP Accepted NF8260M5 Open Platform, contributed by Inspur and Intel


A high-density, widely flexible, and powerful four socket 2U server which adapts to any demanding enterprise cloud workload with ultra-dense memory design to enhance space efficiency.

SAP Certified: Hardware for SAP HANA


OCP Accepted™

Jointly contributed by Inspur and Intel

Scalable 4P Performance in a Dense 2U Form Factor.

Designed for the enterprise, all the power and capacity required to meet business needs.

Reliability for Multiple Workloads.

Support for up to two 2000W Power Supplies for increasing redundancy and reducing unnecessary downtime.

Flexible Expandability.

Support up to eight PCI-E expansion cards, including graphic processor units and network adapters, offering increased expandability.

Redis Workload Demo on the OCP Accepted 2U 4-Socket NF8260M5

In this video, see Inspur’s cloud-optimized 4-socket NF8260M5 leverage Intel Optane Memory to deliver ideal performance for enterprise cloud workloads.

Inspur at OCP Global Summit 2019 | NF8260M5 High-Density Cloud-Optimized Platform

At OCP Global Summit 2019, Intel Fellow Mohan Kumar introduces Inspur’s NF8260M5 4-socket high-density cloud-optimized platform, jointly designed by Inspur and Intel to address enterprise cloud workloads.


Feature NF8260M5 Technical Specification
Form Factor 2U rack-mount, 446.0mm (W) * 87mm (H) * 779.5mm (D)
Processor 2 or 4 Intel® Xeon® Scalable processors, TDP 205W
Chipset Intel ® C620 series chipset
Memory Up to 48 DIMMs, with the maximum memory frequency up to 2933 MHz; it supports RDIMM / LRDIMM, NVDIMM and Optane™ PMem
Storage Up to 24*2.5-inch SAS/SATA Drives
up to 6*U.2 NVMe SSDs
2 built-in M.2 SSDs, and soft RAID 0/1
Disc controller Supports 12G RAID card, RAID0, 1, 10, 5, 50, 6, 60, etc.
Super capacitor Cache protection, RAID status migration and RAID configuration memory
Expansion Up to 8 PCIe3.0 and 1 OCP slot
Front I/O 2 USB interfaces, 1 VGA interface and LCD diagnostic display
Rear I/O 2 USB 3.0 interfaces, 1 VGA interface, 1 special MGMT port, 1 BMC diagnosis serial port and 1 system serial port
Internal I/O 1 USB 3.0 interface
Network OCP 25Gb, 1/2 port or PHY 1Gb/10Gb/40Gb, 2/4 port
Management Onboard BMC management module, support IPMI, SOL, KVM Over IP, virtual media, etc.
1 rear BMC special MGMT port and 1 BMC diagnosis serial port for off-line fault diagnosis
Safety Supports TPM2.0
OS Microsoft Windows Sever, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, CentOS, VMware ESXi, etc.
Working temperature 0°C~40°C
Power supply Platinum-level 550 / 800 / 1,300 / 1,600 / 2,000 W CRPS power supply module with 1+1 redundancy
Working environment humidity 20%-80%RH
Performance benchmarks SPEC official result
Best application: Intel Xeon Gold 6230N  Intel Xeon Gold 6252

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