Flexible High Density 2U 4-Socket Server

OCP Accepted NF8260M5 Open Platform, contributed by Inspur and Intel


A high-density, widely flexible, and powerful four socket 2U server which adapts to any demanding enterprise workload with ultra-dense memory design to enhance space efficiency.


OCP Accepted™

Jointly contributed by Inspur and Intel

Scalable 4P Performance in a Dense 2U Form Factor.

Designed for the enterprise, all the power and capacity required to meet business needs.

Reliability for Multiple Workloads.

Support for up to two 2000W Power Supplies for increasing redundancy and reducing unnecessary downtime.

Flexible Expandability.

Support up to eight PCI-E expansion cards, including graphic processor units and network adapters, offering increased expandability.

Redis Workload Demo on the OCP Accepted 2U 4-Socket NF8260M5

In this video, see Inspur’s cloud-optimized 4-socket NF8260M5 leverage Intel Optane Memory to deliver ideal performance for enterprise cloud workloads.

Inspur at OCP Global Summit 2019 | NF8260M5 High-Density Cloud-Optimized Platform

At OCP Global Summit 2019, Intel Fellow Mohan Kumar introduces Inspur’s NF8260M5 4-socket high-density cloud-optimized platform, jointly designed by Inspur and Intel to address enterprise cloud workloads.


Feature NF8260M5 Technical Specification
Form Factor 2U rack-mount, 780mm (D)
Processor Intel® Xeon® Scalable, two-socket/four-socket, support max. 28 cores
Chipset Intel ® C620 series chipset
Memory 12 DIMM slots per processor, 6 channels per processor, 2 DIMM per channel
Max. Capacity (RDIMM): 1.5TB, 48x 32GB @2666 MHz
Max. Capacity (LRDIMM): 6.0TB, 48x 128GB @2666 MHz
PCI Slots Up to 8x standard PCI-E slots and support one optional OCP Mezz
Internal Storage  Up to 24x 2.5” SAS/SATA or 6x NVMe SSD
Ethernet Integrated LAN controller; up to 4x 10GbE
Power Supply 800W/1300W/1600W/2000W, support 1+1 redundancy
M.2 & SD support Up to two M.2

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