NF8260M6

Cloud-optimized high-density computing platform delivering advanced performance for cloud applications and virtual machines.

Advanced 4-socket design for cloud and VMs.

NF8260M6 is powered by four 3rd Generation Intel Xeon Scalable processors each with 12 DIMMs in a compact 2U form factor, offering high-density performance and Intel Optane PMem 200 memory in several flexible configurations for a variety of cloud computing and data-intensive applications.

Compute Density

• 2U 4-socket design doubles space efficiency and rack utilization vs 4U 4-socket


Reliable Performance

• BMC/BIOS Dual chip redundancy
• Multiple RAS and security features


Flexible Scalability

• Multiple storage configurations in 2U with 25/24 drive design and 24 NVMe all-flash
• 12 PCIe 3.0 slots increase expansion capacity by 50%
• 6 onboard vertical slots eliminates need for a riser, lowering capex
• FPGA and Intelligent Network Card Adaptation

4-Socket Design Optimized for Cloud Applications

  • 4-socket design enables double the virtual machine connections and higher virtualization integration ratio compared to previous 2-socket iteration
  • More VMs are integrated on a single physical machine, and information can be exchanged directly through UPI, effectively reducing virtual access latency and increasing access bandwidth
  • Reduces Capex by ~13%, TCO by ~7%

Flexible Configurations

2 Front Panel Configurations

24 drives:
24* SAS/SATA/NVME (3*8 2.5″ Backplane)

25 drives:
25* SAS/SATA (1*25*2.5″ Backplane)

Model NF8260M6
Processor Up to 4 Intel ® Xeon ® 3rd Generation Intel Xeon Scalable processors
Up to 28 cores (2.9GHz)
Max. speed of 3.9GHz (8 cores)
6 UPI interconnected chains and up to 10.4GT/s per chain
Max. power of 250W
Chipset Intel C621A
Storage Front: up to 24/25 x 2.5-inch drives, and (optional) 24 x NVMe SSDs
Built-in: support up to 2 x M.2 SSDs and 2 x Micro SD cards
Memory Up to 48 DDR4 DIMMs, max. speed of 3,200MT/s
RDIMM and LRDIMM, and max.128G for each
Up to 12 DIMMs per CPU (48 DIMMs/4CPUs)
24 Intel® Optane™ Persistent Memory 200 Series, max. 512GB for each
Storage Controller SATA controller that supports RAID 0/1/5/10
NVMe controller with optional Intel NVMe RAID Key
Optional standard PCIe RAID controller
Network Port OCP 3.0 x16 network cards (options: 1/10/25/100 Gb) and standard PCIe cards (options: 1/10/25/40/100 Gb)
I/O Expansion Up to 12 x standard PCIe slots and 1 x OCP 3.0 slot
Ports Front: 1x USB2.0 port, 1x USB3.0 port, 1x VGA port
Rear: 2 x USB3.0 ports, 1 x VGA port
Built-in: 1 x USB3.0 port, 1 x VGA port, 1 x dedicated management port, 1 x BMC port, and 1 x COM port
Fans 6 x hot-swap N+1 redundant fans
Power Supply Up to 2 x 800W/1300W/1600W/2000W CRPS power supplies (Platinum), 1+1 redundancy. Option: titanium-level
System Management On-board BMC provides a 1Gb RJ45 management port that is dedicated to remote management of IPMI
BMC Flash on-chip redundancy
OS Microsoft Windows Server, Red Hat Linux, SUSE Linux Enterprise Server, CentOS, Vmware ESXi, etc
Operational Temperature 5℃ to 45℃ (41℉ to 113℉)
Weight and Dimension Less than 34 kg at full load
435mm x 87mm x 841mm / 17.12 inch x 6.87 inch x 33.11 inch

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