Product
Compute
Inspur OCP Compute Node: High Compute Density
Key Features:
- High Compute Density OCP Compute Node
- Energy Conservation
- Converged Architecture
Overview
Inspur OCP Compute Family:
High-Density Converged Architecture
Inspur’s OCP portfolio has added 4 new configurations of compute node based on the “San Jose” Motherboard, the first OCP-accepted motherboard based on the Intel® Xeon® Scalable processor.
High Density & Excellent Performance
- 4 types of mixable high-density nodes optimized for difference application scenarios
Energy Conservation
- Centralized power
- All nodes & I/O front access fit hyper-scale data centers
Converged Architecture
- One motherboard converts 4 types of compute node for multiple applications
- High quality, easy maintenance and high cost efficiency
Resources
| Model | Inspur OCP Compute Node: High Compute Density |
|---|---|
| CPU | 2 x Intel® Xeon® Scalable Processer, TDP up to 165W |
| Chipset | Intel® C622 |
| Memory | 16 x DDR4 DIMM; Support RDIMM/LRDMM/NVDIMM |
| Storage | Front: 1 x 3.5 HDD; Internal: 2 x M.2 SATA/PCIe x4 |
| Ethernet | No integrated Ethernet port; OCP2.0 Ethernet card optional |
| I/O | Up to 2 PCIe x16 slot (FHFL) |
| PSU | Bus Bar |
| Dimension | 830mm (L) × 537mm (W) × 95.2mm (H) |