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Hardware Design & Customization
Global Manufacturing
Scalability
Open Innovation
Rapid NPI
Intelligent Manufacturing
Global Supply Chain & Fulfillment
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Inspur Trusted Supply Chain
Products
Rackmount Servers
GPU Accelerated
Data Center Optimized
Storage Enhanced
Single & Dual Processor
Multi-Processor
Multi-Node
Form Factor
1U
2U
4U
8U
Open Platforms
OCP
Open19
ODCC
OCP Cloud Rack for SAP HANA
OCP Cloud Rack for AI
Rackscale Systems
OCP Rack
ODCC
OCP Cloud Rack for SAP Hana
OCP Cloud Rack for AI
Solutions
AI & Deep Learning Solutions
FPGA
Open Solutions
Open19
Composable Infrastructure
Hyperconverged Infrastructure
Intel Select Solutions
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Multi-Processor
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Multi-Processor
High-Expansion
NF8480M6 (4U 4-Socket)
four 3rd Generation Intel Xeon Scalable processors
up to 18TB of memory
up to 18 PCIe Gen3 slots
Compute
NF8260M6 (2U 4-Socket)
four 3rd Generation Intel Xeon Scalable processors each with 12 DIMMs
Intel Optane PMem 200 DIMMs provide 4.5TB memory per node
high density for data-intensive applications
High-Density
NF8260M5 (2U 4-Socket)
Scalable 4P Performance in a Dense 2U Form Factor
Support for up to two 2000W Power Supplies for increased redundancy and reduced downtime
Support up to eight PCI-E expansion cards, including graphic processor units and network adapters, offering increased expandability
Compute
NF8380M5 (3U 4-Socket)
4-socket, up to 4* Intel Xeon Processor
M.2 riser flash array configurations for GPU, FPGA or NVMe
10* PCIe x16
Up to 24 AEP memory
High-Density
NF8480M5 (4U 4-Socket)
Extreme performance: CPUs of up to 28 cores and 56 threads, and max 205W TDP
16GB 24* 2666 MT/ s NVDIMM memory
12* hot swap NVMe SSD
2* dual-width GPUs each delivering 20 trillion FP16 performance
Flexible expansion: up to 48* 2.5”/3.5” hard drives, 12* U.2 NVMe SSD, 2 built-in M.2 SSDs
Compute
TS860M5 (4U 8-Socket)
Extreme computing power: 4U contains 8x Intel Xeon Skylake Gold/Platinum series processors
Supports 2.5-inch NVMe SSD
12T high performance memory, suitable for HPC large memory applications
Flexible and reliable: fully modular redundant design for power-off protection
Intelligent system monitoring